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[Information] On the bonding interface of Cu wire bonding

It provides a detailed explanation of various wire bonding techniques, results, and discussions!

This document presents the bonding interface of Cu wire bonding in semiconductor packages. It provides a detailed explanation of samples and methods, various wire bonding techniques, results, and discussions, accompanied by figures and photographs. [Contents] ■ Introduction ■ Samples and Methods ■ Various Wire Bonding Techniques ■ Results and Discussion ■ Conclusion ■ References *For more details, please refer to the PDF document or feel free to contact us.

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